NV3 configuration: Difference between revisions
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Created page with "There are several different ways that an NV3-based GPU can be configured, depending on the level of flexibility required and who is configuring it. Configuration is done at either the OEM card design level, the manufacture time of the chip, or at the VBIOS or driver level. Each of these have their own mechanisms for configuration; some appear to be burned in with a focused ion beam (FIB)-type situation, others use physical solder-bridged jumpers or other similar mechanis..." |
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There are several different ways that an NV3-based GPU can be configured, depending on the level of flexibility required and who is configuring it. Configuration is done at either the OEM card design level, the manufacture time of the chip, or at the VBIOS or driver level. Each of these have their own mechanisms for configuration; some appear to be burned | There are several different ways that an NV3-based GPU can be configured, depending on the level of flexibility required and who is configuring it. Configuration is done at either the OEM card design level, the manufacture time of the chip, or at the VBIOS or driver level. Each of these have their own mechanisms for configuration; some appear to be burned into the silicon with a focused ion beam (FIB)-type technique, others use physical solder-bridged jumpers or other similar mechanisms at the board level, and others are done via software. In some cases, multiple of these methods are usable. | ||
== Configuration types == | == Configuration types == | ||
Revision as of 18:52, 7 August 2025
There are several different ways that an NV3-based GPU can be configured, depending on the level of flexibility required and who is configuring it. Configuration is done at either the OEM card design level, the manufacture time of the chip, or at the VBIOS or driver level. Each of these have their own mechanisms for configuration; some appear to be burned into the silicon with a focused ion beam (FIB)-type technique, others use physical solder-bridged jumpers or other similar mechanisms at the board level, and others are done via software. In some cases, multiple of these methods are usable.